{"id":367513,"date":"2017-09-01T08:24:44","date_gmt":"2017-09-01T12:24:44","guid":{"rendered":"http:\/\/spaceweekly.com\/?guid=29ffd8af7ff6beaee22680430f1b4654"},"modified":"2017-09-01T08:24:44","modified_gmt":"2017-09-01T12:24:44","slug":"a-technology-for-pressureless-sinter-joining-for-next-generation-power-semiconductors","status":"publish","type":"post","link":"https:\/\/spaceweekly.com\/?p=367513","title":{"rendered":"A technology for pressureless sinter joining for next-generation power semiconductors"},"content":{"rendered":"<p>Silver micron-particle sintering joining technology developed by Professor SUGANUMA Katsuaki at The Institute of Scientific and Industrial Research, Osaka University, is promising for next-generation power semiconductor, GaN. By improving silver paste, he has developed low-temperature pressureless die bonding, which can be used for all types of electrodes, including Cu and Au, as well as silver coating. These achievements have enabled low-cost, reliable heat-resistant mounting technology for die attach and for printed wiring without changing a conventional cheap electrode structure.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Silver micron-particle sintering joining technology developed by Professor SUGANUMA Katsuaki at The Institute of Scientific and Industrial Research, Osaka University, is promising for next-generation power semiconductor, GaN. By improving silver paste,&#8230;<\/p>\n","protected":false},"author":0,"featured_media":615444,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-367513","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry"],"_links":{"self":[{"href":"https:\/\/spaceweekly.com\/index.php?rest_route=\/wp\/v2\/posts\/367513","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/spaceweekly.com\/index.php?rest_route=\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/spaceweekly.com\/index.php?rest_route=\/wp\/v2\/types\/post"}],"replies":[{"embeddable":true,"href":"https:\/\/spaceweekly.com\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=367513"}],"version-history":[{"count":1,"href":"https:\/\/spaceweekly.com\/index.php?rest_route=\/wp\/v2\/posts\/367513\/revisions"}],"predecessor-version":[{"id":367514,"href":"https:\/\/spaceweekly.com\/index.php?rest_route=\/wp\/v2\/posts\/367513\/revisions\/367514"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/spaceweekly.com\/index.php?rest_route=\/wp\/v2\/media\/615444"}],"wp:attachment":[{"href":"https:\/\/spaceweekly.com\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=367513"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/spaceweekly.com\/index.php?rest_route=%2Fwp%2Fv2%2Fcategories&post=367513"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/spaceweekly.com\/index.php?rest_route=%2Fwp%2Fv2%2Ftags&post=367513"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}