{"id":461901,"date":"2018-04-09T09:22:00","date_gmt":"2018-04-09T13:22:00","guid":{"rendered":"http:\/\/spaceweekly.com\/?guid=456bcd22a14b8893233d0f5c2f13c5f5"},"modified":"2018-04-09T09:22:00","modified_gmt":"2018-04-09T13:22:00","slug":"3d-molded-interconnect-devices","status":"publish","type":"post","link":"https:\/\/spaceweekly.com\/?p=461901","title":{"rendered":"3D-molded interconnect devices"},"content":{"rendered":"<p>\t\t\t\t\t<img loading=\"lazy\" decoding=\"async\" src=\"http:\/\/www.esa.int\/var\/esa\/storage\/images\/esa_multimedia\/images\/2018\/04\/3d-molded_interconnect_devices\/17444936-1-eng-GB\/3D-molded_interconnect_devices_small.jpg\" width=\"170\" height=\"96\" align=\"left\" hspace=\"8\" \/><\/p>\n<p>\nAn alternative to conventional circuit boards, these \u20183D-molded interconnect devices\u2019 add electrical connectivity to the surface of three-dimensional structures.\n<\/p>\n<p>\nThe aim is to combine mechanical, electronic and potentially optical functions in a single 3D part, allowing the creation of intricate, precisely aligned designs using fewer parts while delivering significant savings in space and weight compared to conventional electronic manufacturing.\n<\/p>\n<p>\n\u201cThese prototype interconnect devices were produced using injection-moulded plastics incorporating electrical metallisation,\u201d explains ESA\u2019s Jussi Hokka. \u201cIn principle, however, other materials can also be used, allowing the incorporation of sensors or the integration of shielding or cooling systems.\u201d\n<\/p>\n<p>\nThey were produced for ESA by <a href=\"http:\/\/art-of-technology.com\/\">Art of Technology AG<\/a>&nbsp;in Switzerland, through the Agency\u2019s <a href=\"http:\/\/www.esa.int\/Our_Activities\/Telecommunications_Integrated_Applications\/ARTES\/ARTES_programme_overview\">Advanced Research in Telecommunications Systems<\/a>&nbsp;programme.&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p><img loading=\"lazy\" decoding=\"async\" src=\"http:\/\/www.esa.int\/var\/esa\/storage\/images\/esa_multimedia\/images\/2018\/04\/3d-molded_interconnect_devices\/17444936-1-eng-GB\/3D-molded_interconnect_devices_small.jpg\" width=\"170\" height=\"96\" align=\"left\" hspace=\"8\"><\/p>\n<p>\nAn alternative to conventional circuit boards, these &lsquo;3D-molded interconnect devices&rsquo; add electrical connectivity to the surface of three-dimensional structures.\n<\/p>\n<p>\nThe aim is to combine mechanical, electronic and potentially optical functions in a single 3D part, allowing the creation of intricate, precisely aligned designs using fewer parts while delivering significant savings in space and weight compared to conventional electronic manufacturing.\n<\/p>\n<p>\n&ldquo;These prototype interconnect devices were produced using injection-moulded plastics incorporating electrical metallisation,&rdquo; explains ESA&rsquo;s Jussi Hokka. &ldquo;In principle, however, other materials can also be used, allowing the incorporation of sensors or the integration of shielding or cooling systems.&rdquo;\n<\/p>\n<p>\nThey were produced for ESA by <a href=\"http:\/\/art-of-technology.com\/\">Art of Technology AG<\/a>&nbsp;in Switzerland, through the Agency&rsquo;s <a href=\"http:\/\/www.esa.int\/Our_Activities\/Telecommunications_Integrated_Applications\/ARTES\/ARTES_programme_overview\">Advanced Research in Telecommunications Systems<\/a>&nbsp;programme.&nbsp;<\/p>\n","protected":false},"author":5,"featured_media":615444,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[27],"tags":[],"class_list":["post-461901","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-multimedia"],"_links":{"self":[{"href":"https:\/\/spaceweekly.com\/index.php?rest_route=\/wp\/v2\/posts\/461901","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/spaceweekly.com\/index.php?rest_route=\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/spaceweekly.com\/index.php?rest_route=\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/spaceweekly.com\/index.php?rest_route=\/wp\/v2\/users\/5"}],"replies":[{"embeddable":true,"href":"https:\/\/spaceweekly.com\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=461901"}],"version-history":[{"count":1,"href":"https:\/\/spaceweekly.com\/index.php?rest_route=\/wp\/v2\/posts\/461901\/revisions"}],"predecessor-version":[{"id":461902,"href":"https:\/\/spaceweekly.com\/index.php?rest_route=\/wp\/v2\/posts\/461901\/revisions\/461902"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/spaceweekly.com\/index.php?rest_route=\/wp\/v2\/media\/615444"}],"wp:attachment":[{"href":"https:\/\/spaceweekly.com\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=461901"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/spaceweekly.com\/index.php?rest_route=%2Fwp%2Fv2%2Fcategories&post=461901"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/spaceweekly.com\/index.php?rest_route=%2Fwp%2Fv2%2Ftags&post=461901"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}