{"id":602475,"date":"2019-04-04T05:48:08","date_gmt":"2019-04-04T09:48:08","guid":{"rendered":"https:\/\/ntrs.nasa.gov\/search.jsp?R=20190002150"},"modified":"2019-04-04T05:48:08","modified_gmt":"2019-04-04T09:48:08","slug":"2-53d-daisy-chain-reliability-evaluation","status":"publish","type":"post","link":"https:\/\/spaceweekly.com\/?p=602475","title":{"rendered":"2.5\/3D Daisy Chain Reliability Evaluation"},"content":{"rendered":"<p>Abstract: The objective of this task is to evaluate thermal cycle behavior of advanced 2.5\/3D electronics \u2014 commercial-off the-shelf (COTS) \u2014packages of different configurations assembled onto printed circuit boards (PCBs). Three key approaches were considered for evaluation. The first approach focused on the through-mold via (TMV\u2122) technology at assembly level. The second approach focused on evaluation of 2.5D (also known as, System in Package (SiP)) in fine pitch ball grid array (FPGA). The third app&#8230;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Abstract: The objective of this task is to evaluate thermal cycle behavior of advanced 2.5\/3D electronics &mdash; commercial-off the-shelf (COTS) &mdash;packages of different configurations assembled onto printed circuit boards (PCBs). Three key approaches were considered for evaluation. The first approach focused on the through-mold via (TMV&trade;) technology at assembly level. The second approach focused on evaluation of 2.5D (also known as, System in Package (SiP)) in fine pitch ball grid array (FPGA). The third app&#8230;<\/p>\n","protected":false},"author":60,"featured_media":615444,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[],"tags":[],"class_list":["post-602475","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry"],"_links":{"self":[{"href":"https:\/\/spaceweekly.com\/index.php?rest_route=\/wp\/v2\/posts\/602475","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/spaceweekly.com\/index.php?rest_route=\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/spaceweekly.com\/index.php?rest_route=\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/spaceweekly.com\/index.php?rest_route=\/wp\/v2\/users\/60"}],"replies":[{"embeddable":true,"href":"https:\/\/spaceweekly.com\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=602475"}],"version-history":[{"count":2,"href":"https:\/\/spaceweekly.com\/index.php?rest_route=\/wp\/v2\/posts\/602475\/revisions"}],"predecessor-version":[{"id":609285,"href":"https:\/\/spaceweekly.com\/index.php?rest_route=\/wp\/v2\/posts\/602475\/revisions\/609285"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/spaceweekly.com\/index.php?rest_route=\/wp\/v2\/media\/615444"}],"wp:attachment":[{"href":"https:\/\/spaceweekly.com\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=602475"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/spaceweekly.com\/index.php?rest_route=%2Fwp%2Fv2%2Fcategories&post=602475"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/spaceweekly.com\/index.php?rest_route=%2Fwp%2Fv2%2Ftags&post=602475"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}