Researchers of the Paul Scherrer Institute PSI have made detailed 3-D images of a commercially available computer chip. This marks the first time a non-destructive method has visualized the paths of a chip’s internal wiring (just 45 nanometres—45 millionths of a millimetre—wide) and its 34-nanometre-high transistors clearly without distortions or deformations. It is a major challenge for manufacturers to determine if, in the end, the structure of their chips conforms to the specifications. Thus these results represent one important application of an X-ray tomography method that the PSI researchers have been developing for several years. In their experiment, the researchers examined a small piece that they had cut out of the chip beforehand. This sample remained undamaged throughout the measurement. The goal now is to extend the method in such a way that it can be used to examine complete chips. The researchers conducted the experiments at the Swiss Light Source SLS of the Paul Scherrer Institute.