Silver micron-particle sintering joining technology developed by Professor SUGANUMA Katsuaki at The Institute of Scientific and Industrial Research, Osaka University, is promising for next-generation power semiconductor, GaN. By improving silver paste, he has developed low-temperature pressureless die bonding, which can be used for all types of electrodes, including Cu and Au, as well as silver coating. These achievements have enabled low-cost, reliable heat-resistant mounting technology for die attach and for printed wiring without changing a conventional cheap electrode structure.