Panasonic Corporation announced today that it has commercialized its low transmission loss flexible multi-layer circuit board materials, suitable for high-speed large-volume data transmission and thinner designs of mobile devices, including smartphones and tablet computers. The company will launch its mass production in January 2017. The combination of a liquid-crystal polymer (LCP) core material and a bonding sheet material that can be laminated at a low temperature and stored at room temperature will considerably ease the manufacture of high-frequency flexible multi-layer circuit boards.