One of the limiting factors for the computing power of processors is the operating temperature. As part of the CarriCool project under the aegis of IBM, Fraunhofer researchers have developed a new, effective cooling method: By integrating microchannels into the silicon interposer it is for the first time possible to cool high-performance processors from the underside as well. As a result, this innovation can achieve a significant increase in performance. Moreover, the scientists have integrated passive components for voltage regulators, photonic ICs and optical waveguides into the interposer.