Scientists from the Solar Energy Research Institute of Singapore (SERIS) at the National University of Singapore (NUS) have developed a low-cost and effective technique to texture diamond-wire sawn (DWS) multicrystalline silicon (mc-Si) wafers. DWS wafers sliced using diamond-coated wires allow substantial cost savings compared to traditional slurry-cut wafers. Texturing is the process of roughening the silicon wafer surface so as to minimise front surface reflection and enhance light trapping, to boost the solar cell efficiency.