This week, at the 2018 IEEE International Electron Devices Meeting (IEDM), imec, the world-leading research and innovation hub in nanoelectronics and digital technologies, presents a 300mm-wafer platform for MOSFET devices with 2-D materials. 2-D materials could provide the path towards extreme device-dimension scaling as they are atomically precise and suffer little from short channel effects. Other possible applications of 2-D materials could come from using them as switches in the BEOL, which puts an upper limit on the allowed temperature budget in the integration flow.