Researchers of Valencia’s Polytechnic University (UPV) and the Spanish National Research Council (CSIC) have developed a new methodology that makes it possible to manufacture high-performance circuits for telecommunications in a fast and cheap way. It integrates 3-D printing, which enables the use of metals and polymers. Furthermore, the researchers also suggest a technique that makes it possible to metalize the printed materials and imbue them with conductivity.
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Source: Phys.org