The amount of digital communication supporting our daily lives continues to increase. This means there is a constant need to improve hardware, including optimizing the performance of printed wiring boards (PWBs). Researchers from Osaka University have demonstrated a method for strongly combining polytetrafluoroethylene (PTFE) and smooth cooper foil. They presented their findings at the INTERFINISH2020 congress.
Click here for original story, Copper and PTFE stick together to support better 5G
Source: Phys.org