The micro/nano metal pattern formation is a key step in the assembly of various devices. However, ex situ approaches of metal patterning limited their industrial applications due to the poor stability and dispersion of metal nanoparticles. The in situ electroless deposition after lithography patterning may be a better choice for avoiding the growth and aggregation of metal particles in the polymers.
Click here for original story, Researchers invent a new metallization method of modified tannic acid photoresist patterning
Source: Phys.org