Scientists from Skoltech developed a self-assembled 3D nanocomposite with outstanding in-plane and out-of-plane heat conductivity, high electrical resistivity, and good hydrophobicity, which have a wide range of potential uses in packaging and electronics for thermal management applications. The study, describing scalable fabrication and composite properties, was published in Polymers.
Click here for original story, 3D nanocomposites boost heat dissipation in electronics
Source: Phys.org